Флюс гел (лепкав флюс) за запояване NC-559-ASM, 100 грама

Флюс: NC-559-ASM
Тегло: 100 грама

- This product is no-clean solder paste, very little residue, without washing.
- The residue is colorless and transparent look excellent.
- Excellent capacity of solder-stickiness.
- Widely used on BGA, PGA, CSP packages and flip chip operation.
- Suitable for multiple PCB reflow.
- It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates.
- It is a necessary and helpful tool in BGA reballing.